Accurate Quotations.
Panelization and Array Design Assistance Prior to Order Placement.
Cost Reduction Analysis Performed Prior to Order Placement.
Computerized Order Entry and Tracking.
Full Time Customer Service Personnel for Order Status and
Delivery Adjustments.
Personalized Assistance for Any Issues Regarding Your Order.
Computer Assisted Order Scheduling and Tracking.
Assigns Jobs and Organizes Priorities for each Department
and Work Center.
Maintains Inventory of Laminate.
Daily Workflow Planning Meeting with All Department Supervisors
in Attendance.
Three Full Time Pre-Production Engineers.
CAD Design Rule Check (DRC) Performed on All New Jobs.
Design for Manufacturability Review Performed on All New Jobs.
Cost Reduction Analysis Confirmed on All New Jobs.
Maintains the Ability to Tool Older Jobs Supplied on Mylar
Artwork (No CAD Available).
Fully Automated Gerber Crescent 30 Photoplotter with Gerber
Escort Automatic Film Loader/Un-loader Utilizing an In-Line
Dupont Film Processor.
CAD Netlist Extraction Performed from Supplied Gerber Files.
Full CAM Tooling Performed on Artwork and CNC Drill/Mill/Score
Files.
Process Traveler and Job Packet Creation/Control.
Computerized Laminate Inventory Control.
Hitachi Mark 100, 5 Spindle, High Precision, High Throughput
Multilayer Drill.
Hit Count Limiter on Hitachi Drill Prevents Overuse of Any
Drill Bit.
Broken Drill Bit Detection Systems to Avoid Missing Holes.
“Zero Set-Up” Tool Selection on Drill for Very
Rapid Job Switchovers.
Drill Bit Inspection Programs.
DNC Automated File Server for CNC File Access.
EdgeMate edge deburring.
Panel Corner rounding.
Panel Pinning for Registration on the Drill.
Near Zero Film Touch-Up Program Due to Automated Photoplotting
System.
Maintain Ability to Perform Manual Step and Repeat for non-CAD
Mylar Jobs.
Shadow Direct Metalization Process.
Multilayer Desmear Line.
Automated Gold Tab Plating Line.
Three Copper Plating Tanks, One Tin Plating Tank.
State of the Art Etcher with Integral Tin Strip Module.
Deep Electroplated Nickel/Hard Gold Process for Heavy Depositions.
In-Line Copper Thickness in the Hole Verification by Three
Separate Methods.
Black Light Hole Wall Inspection on Every Panel to Verify
Void Free Holes.
100% Visual Inspection of Every Panel Processed.
Pin Gage and Caviderm (Eddy Current) Verification of Copper
Thickness in Holes.
Cross Section Analysis of Inner Layer Connections on Every
Multilayer Job.
Camtek Orion A.O.I. Unit for Inspection of Films, Photo-resisted
panels, Inner and Outer Layer Panels.
Thermal Screened SR1000 Series Epoxy Soldermask Offered.
Liquid Photo Imageable (LPI) Soldermask Using Taiyo Ink is
Standard.
LPI Legend Application Available for Very Fine Characters
in the Silkscreen Layer.
Tunnel Oven for very Accurate, Even Tack Curing of LPI Coated
Panels.
LPI Exposer
Vertical Hot Air Leveling, This is Our Standard Surface Finish.
100% CAD Generated Netlist Fixture Design and Panel Testing
is Standard.
In-House Fixture Design, Drilling and Building.
HI-Pot Tester for Verifying Resistance to Dielectric Breakdown
and Voltage Cross-Over.
DNC Automated File Server for CNC File Access.
Two Excellon CNC Routers.
CNC Score Machine with ‘Jump’ or ‘Skip’
Scoring Ability.
Gold Tab Beveler.
Maintains Adherence to Quality and Regulatory Requirements
such as ISO 9001:2000, U.L., IPC.
Surface Insulation Resistance (SIR) Testing Performed and
Certified by Independent Lab.
Ionic Cleanliness Testing and Certification.
Tensile and Elongation (T&E) Testing Performed and Certified
by Independent Lab.
Full Tool Calibration Program.
Fully Documented Work Instructions for All Departments.
In-House ISO Audit Team to Maintain Certification.
Process Documentation.
Control of Approved Vendor List.
Responsible for Maintaining, Optimizing and Improving the
Manufacturing Process.
Researches, Develops, and Brings in New Technologies to the
Company.
Computerized LAB Control Insures All Testing and Monitoring
is Performed When Required.
Computerized History and SPC Charting Provide Critical Information
to Monitor Processes.
Ionic Contamination Test Chamber Monitors Board Cleanliness
Before and After Soldermask Application on a Daily Basis.
Atomic Absorption Spectrophotometer (AA) Unit Used to Verify
and Maintain Chemical Make-Ups.
Total Organic Contamination (TOC) Unit is Utilized to Analyze
Plating Bath Purity.
Cross Section Equipment Utilized to Verify Hole Quality and
Inner-layer connections.
Solder Pot Used to Perform Solder Samples and Thermal Shock
Testing on Multilayer Product.
Certified Inspectors Program.
AQL Mechanical Dimensional Check on Each Order.
100% Visual Inspection Performed.
Computerized Shipping and Order Tracking System.
New Employee Orientation Program (Board Handling, Use of Fire
Extinguishing and Safety Equip., Chemical Handling, etc.).
Pre-employment / Post Accident Drug & Alcohol Testing.
Tuition Reimbursement Program.
On-the-Job Training.
Instruction on the Quality Policy.
Forklift Training.
Lock-Out Tag-Out Safety Program.
Hearing Conservation Program.
Confined Spaces Training.
Employee Safety Training.
MSDS Training.
Safety Team with Safety Inspections.
Fully Equipped, Full-Time In-House Maintenance Department.
Preventative Maintenance Programs In Place.
Two Full-Time Employees Devoted to Environmental Control Issues.
Atomic Absorption Spectrophotometer (AA) Unit Used to Analyze
Spent Process Materials for Adherence to Local and State Regulations.
100% Recycled Process Materials (No Landfilling).
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